SEMICONDUCTOR PACKAGE

A metallic ring (2) is provided on the multilayer ceramic substrate (1). An optical semiconductor laser (6) is provided on the multilayer ceramic substrate (1) inside the metallic ring (1). A metallic cap (10) with a window (9) is joined to the metallic ring (2). The metallic ring (2) covers the opt...

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Bibliographische Detailangaben
1. Verfasser:	MATSUSUE, AKIHIRO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A metallic ring (2) is provided on the multilayer ceramic substrate (1). An optical semiconductor laser (6) is provided on the multilayer ceramic substrate (1) inside the metallic ring (1). A metallic cap (10) with a window (9) is joined to the metallic ring (2). The metallic ring (2) covers the optical semiconductor laser (6). An external heat sink (11) is joined to an external side surface of the metallic cap (10). These features make it possible to improve high-frequency characteristic, producibility and heat dissipation.