Assembly comprising a delivery module, an interconnection apparatus and an electronic control unit

It is proposed an interconnection apparatus comprising: - a substantially planar substrate (400) having a first side and a second side; - at least one first connector (415, 425) arranged on the first side; and - at least one second connector (435) arranged on the second side. The apparatus is such t...

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Hauptverfasser: BONZOM, RENAUD, HERDIER, ROMAIN
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:It is proposed an interconnection apparatus comprising: - a substantially planar substrate (400) having a first side and a second side; - at least one first connector (415, 425) arranged on the first side; and - at least one second connector (435) arranged on the second side. The apparatus is such that it is adapted to compensate an alignment error of complementary connectors (215, 225; 335) intended to be mated with the first connector(s) (415, 425) and the second connector(s) (435).