PRE-APPLIED UNDERFILL

PRE-APPLIED UNDERFILL

Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first polymer region and a second polymer region, wherein the second polymer region comprises inorganic filler. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-...

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Hauptverfasser: GALLAGHER, MICHAEL K, TRUONG, CHI Q, CALVERT, JEFFREY M, DHOBLE, AVIN V, ANZURES, EDGARDO, FLEMING, DAVID, CHOUBEY, ANUPAM
Format: Patent
Sprache:eng ; fre ; ger
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LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
TRANSPORTING
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creator GALLAGHER, MICHAEL K
TRUONG, CHI Q
CALVERT, JEFFREY M
DHOBLE, AVIN V
ANZURES, EDGARDO
FLEMING, DAVID
CHOUBEY, ANUPAM
description Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first polymer region and a second polymer region, wherein the second polymer region comprises inorganic filler. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-layer structured pre-applied underfill.
format Patent
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language eng ; fre ; ger
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subjects LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
TRANSPORTING
title PRE-APPLIED UNDERFILL
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