PRE-APPLIED UNDERFILL

Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first polymer region and a second polymer region, wherein the second polymer region comprises inorganic filler. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-...

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Bibliographische Detailangaben
Hauptverfasser:	GALLAGHER, MICHAEL K, TRUONG, CHI Q, CALVERT, JEFFREY M, DHOBLE, AVIN V, ANZURES, EDGARDO, FLEMING, DAVID, CHOUBEY, ANUPAM
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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Beschreibung
Zusammenfassung:	Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first polymer region and a second polymer region, wherein the second polymer region comprises inorganic filler. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-layer structured pre-applied underfill.