Wire saw device with sensor arrangement and method for monitoring the operation of the wire saw device

A wire saw device (200) for sawing a semiconductor work piece is provided. The wire saw device includes a spool reception arrangement (210) for receiving a spool (250), the spool including a spool flange (260; 270) at each end of the spool; and a sensor arrangement (220) for measuring the operation...

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Bibliographische Detailangaben
Hauptverfasser:	Zominy, Claude, Billod, Mathieu
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BROACHING FILING LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PLANING SAWING SCRAPING SHEARING SLOTTING TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	A wire saw device (200) for sawing a semiconductor work piece is provided. The wire saw device includes a spool reception arrangement (210) for receiving a spool (250), the spool including a spool flange (260; 270) at each end of the spool; and a sensor arrangement (220) for measuring the operation condition of at least one of the spool flanges (260; 270). Further, a method for measuring the operation condition of a wire saw device (200) for sawing a semiconductor work piece is described. The wire saw device includes a spool reception arrangement (210) for receiving a spool (250) including one flange (260; 270) at each end of the spool. The method includes measuring the operation condition of at least one of the spool flanges by a sensor arrangement (220).