METHOD OF MARKING A CHIP CARD MODULE BY ELECTRODEPOSITION

METHOD OF MARKING A CHIP CARD MODULE BY ELECTRODEPOSITION

The invention relates to a method of marking a face layout (10, 20, 30, 60, 90) of an electronic chip card module, comprising the step consisting in depositing a coating layer (90) on a partial zone of a metallic layer (60), a prior step consisting in the placing of a mask on a distinct zone from sa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PROYE, Cyril, DIEU-GOMONT, Séverine, HOVEMAN, Bertrand, DE MAQUILLE, Yannick, FOURGEOT, Sébastien
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CALCULATING
COMPUTING
COUNTING
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
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Beschreibung
Zusammenfassung:The invention relates to a method of marking a face layout (10, 20, 30, 60, 90) of an electronic chip card module, comprising the step consisting in depositing a coating layer (90) on a partial zone of a metallic layer (60), a prior step consisting in the placing of a mask on a distinct zone from said partial zone, the coating layer (90) deposited on the partial zone of the metallic layer (60) being composed of a material chosen from the group consisting of palladium and an alloy comprising at least 50% by weight of palladium.