VACUUM SUCTION STAGE, SEMICONDUCTOR WAFER DICING METHOD, AND SEMICONDUCTOR WAFER ANNEALING METHOD

VACUUM SUCTION STAGE, SEMICONDUCTOR WAFER DICING METHOD, AND SEMICONDUCTOR WAFER ANNEALING METHOD

The present invention is intended to provide a vacuum suction stage that suppresses damage on a dicing tape during dicing and a method of dicing a semiconductor wafer using the vacuum suction stage. The present invention is further intended to provide a method of annealing a semiconductor wafer usin...

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1. Verfasser: MATSUMURA TAMIO
Format: Patent
Sprache:eng ; fre ; ger
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator MATSUMURA TAMIO
description The present invention is intended to provide a vacuum suction stage that suppresses damage on a dicing tape during dicing and a method of dicing a semiconductor wafer using the vacuum suction stage. The present invention is further intended to provide a method of annealing a semiconductor wafer using the vacuum suction stage that suppresses bubble formation in a grinding protection tape. The vacuum suction stage of the present invention includes a placement surface 1a on which a semiconductor wafer 6 is to be placed. A vacuum suction hole 2 is formed in the placement surface 1a only in an area external to a chip region 6a of the semiconductor wafer 6.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title VACUUM SUCTION STAGE, SEMICONDUCTOR WAFER DICING METHOD, AND SEMICONDUCTOR WAFER ANNEALING METHOD
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