VACUUM SUCTION STAGE, SEMICONDUCTOR WAFER DICING METHOD, AND SEMICONDUCTOR WAFER ANNEALING METHOD

The present invention is intended to provide a vacuum suction stage that suppresses damage on a dicing tape during dicing and a method of dicing a semiconductor wafer using the vacuum suction stage. The present invention is further intended to provide a method of annealing a semiconductor wafer usin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	MATSUMURA TAMIO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention is intended to provide a vacuum suction stage that suppresses damage on a dicing tape during dicing and a method of dicing a semiconductor wafer using the vacuum suction stage. The present invention is further intended to provide a method of annealing a semiconductor wafer using the vacuum suction stage that suppresses bubble formation in a grinding protection tape. The vacuum suction stage of the present invention includes a placement surface 1a on which a semiconductor wafer 6 is to be placed. A vacuum suction hole 2 is formed in the placement surface 1a only in an area external to a chip region 6a of the semiconductor wafer 6.