Housing, power module and electrical power converter

According to a first aspect, a housing (1, 1') is provided for housing at least one power semiconductor (2), the housing comprising: two openings (4); and two movable covers (10) provided respectively by the two openings (4). Each movable cover (10) is arranged to move, during operation, from a...

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Bibliographische Detailangaben
Hauptverfasser: SPINDLER, CHRISTIAN, DURAN, HAMIT
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:According to a first aspect, a housing (1, 1') is provided for housing at least one power semiconductor (2), the housing comprising: two openings (4); and two movable covers (10) provided respectively by the two openings (4). Each movable cover (10) is arranged to move, during operation, from an open state, in which the respective cover does not cover its respective opening, to a closed state, in which the respective cover covers its respective opening, when the respective cover is subjected to a pressure from a shockwave occurring inside the housing. A corresponding power module and electrical power converter are also presented.