Inline deposition control apparatus and method of inline deposition control

An inline deposition control apparatus (100) for a vacuum deposition apparatus having one or more deposition sources for depositing one or more deposition layers on a substrate (11), includes one or more light sources (142) adapted to illuminate the substrate having the one or more deposition layers...

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Bibliographische Detailangaben
1. Verfasser:	LOTZ, HANS-GEORG
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	An inline deposition control apparatus (100) for a vacuum deposition apparatus having one or more deposition sources for depositing one or more deposition layers on a substrate (11), includes one or more light sources (142) adapted to illuminate the substrate having the one or more deposition layers; a detection arrangement (160) adapted for spectrally resolved detection of a measurement signal, wherein the measurement signal is selected from at least one of: light reflected at the substrate having the one or more deposition layers, and light transmitted through the substrate having the one or more deposition layers; an evaluation unit (170) to determine the respective thicknesses of the one or more layers based on the measurement signal; and a controller (180) connected to the evaluation unit and connectable to the deposition apparatus for feed-back control of the deposition of the one or more deposition layers based on the determined thicknesses. Furthermore, a method of inline deposition control is provided.