EPOXY COMPOUND HAVING ALKOXY SILYL GROUP, COMPOSITION COMPRISING SAME, CURED PRODUCT, USE THEREOF AND METHOD FOR PREPARING EPOXY COMPOUND HAVING ALKOXY SILYL GROUP

The present invention relates to an alkoxy silyl-based epoxy compound exhibiting excellent heat resistant characteristics in a composite, and more particularly, exhibiting a low coefficient of thermal expansion (CTE) and the effect of significantly increasing the glass transition temperature in a composite and eliminating the necessity of a separate silane coupling agent. The present invention also relates to a composition comprising the compound, to a cured product thereof, to the use thereof and to a method for preparing an epoxy compound comprising an alkoxy silyl group. Thus, according to the present invention, provided are an epoxy compound comprising an epoxy group and an alkoxy silyl group, a composition comprising the epoxy compound and a curing agent, a filler and/or a reaction catalyst, a cured product thereof and the use thereof such as in an electronic component or the like. The epoxy composition comprising an epoxy compound having a novel alkoxy silyl group according to the present invention is obtained by a chemical bond resulting from a chemical reaction between the alkoxy silyl group and a filler (fiber and/or particle) and a chemical reaction between alkoxy silyl groups in a composite and/or a cured product, thus exhibiting effects of improved heat resistant characteristics, that is, a lower CTE and a higher glass transition temperature or no glass transition temperature (hereinafter, referred to as 'Tg-less') in an epoxy composite. Furthermore, the cured product comprising an epoxy compound having an alkoxy silyl group according to the present invention exhibits excellent flame resistance by introducing the alkoxy silyl group thereto.