HOUSING FOR ELECTRONIC COMPONENTS

The invention relates to a housing for electronic components with the housing comprising at least a front housing part and a rear housing part. The front housing part and the rear housing part are arranged to be sealed by means of a sealing gasket upon attaching the front housing part to the rear ho...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HILLSTRÖM, Per, FÄRDIG, Mikael, OLSSON, Sofia, FREDRIKSSON, Daniel
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention relates to a housing for electronic components with the housing comprising at least a front housing part and a rear housing part. The front housing part and the rear housing part are arranged to be sealed by means of a sealing gasket upon attaching the front housing part to the rear housing part. The housing comprises at least one ventilation opening to prevent build-up of negative pressure inside the housing, where the ventilation opening is covered by a protective covering comprising a through opening. The through opening is arranged to allow water to flow through the through opening, thereby preventing a build up of pressure inside the protective covering. A method for manufacturing a housing according to the invention is also disclosed.