Light emitting device package

Disclosed is a light emitting device package including a package body having at least one cavity, at least one light emitting device mounted on the cavity, and a molding member disposed on the light emitting device to fill the cavity. The package body has at least one first recess formed at an upper...

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Bibliographische Detailangaben
1. Verfasser: PARK, HAEJIN
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:Disclosed is a light emitting device package including a package body having at least one cavity, at least one light emitting device mounted on the cavity, and a molding member disposed on the light emitting device to fill the cavity. The package body has at least one first recess formed at an upper portion than a bottom surface of the cavity, and the molding member is disposed to an inner edge of the at least one first recess.