ADHESIVE FOR PRODUCING COMPOUND BODIES, PRIMARILY A PLASTIC-GLASS COMPOUND OR COMPOUND GLASS, FOR ARCHITECTURE AND CONSTRUCTION

Provided is an adhesive composition suitable for producing a laminate. The composition contains specified amounts of (a) polyisobutyl methacrylate, isobutyl methacrylate or a mixture thereof, (b) butyl acrylate, (c) polybutyl acrylate, (d) a (meth)acrylate compound and (e) a silicon compound. These...

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Bibliographische Detailangaben
Hauptverfasser:	RECKTENWALD, ROGER, HASSKERL, THOMAS, SCHWARZ-BARAC, SABINE, KORALEWSKI, KLAUS, BAND, FLORIAN, HÖSS, WERNER
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES WORKING-UP
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Beschreibung
Zusammenfassung:	Provided is an adhesive composition suitable for producing a laminate. The composition contains specified amounts of (a) polyisobutyl methacrylate, isobutyl methacrylate or a mixture thereof, (b) butyl acrylate, (c) polybutyl acrylate, (d) a (meth)acrylate compound and (e) a silicon compound. These components may be in polymerizable form, in polymerized form or in a combination of polymerizable form and polymerized form. The amounts of components (a) to (e) total 100 wt. % and the amount of (b) and (c) represents 30 to 90 wt. %, based on the sum total of components (a) to (e). The composition may optionally further contain from 0.1 to 6 wt. %, based on the total weight of the adhesive composition, of additives different from components (a) to (e) described above.