RAPID GAS DECOMPRESSION-RESISTANT FLUOROELASTOMER COMPOSITIONS AND MOLDED ARTICLES

The disclosure herein includes rapid gas decompression (RGD)-resistant fluoroelastomeric compositions and includes a curable fluoropolymer having a curesite monomer with at least one functional group capable of curing with a peroxide curative. The compositions include a bisphenyl-based curative and...

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Bibliographische Detailangaben
1. Verfasser:	CAMPBELL, RONALD, R
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	The disclosure herein includes rapid gas decompression (RGD)-resistant fluoroelastomeric compositions and includes a curable fluoropolymer having a curesite monomer with at least one functional group capable of curing with a peroxide curative. The compositions include a bisphenyl-based curative and an organic peroxide curative and an organic peroxide co-curative. The fluoroelastomeric compositions have a ratio of the bisphenyl-based curative to the organic peroxide co-curative of about 0.25:1 to about 1.5:1 and a ratio of the bisphenyl-based curative to the organic peroxide of about 0.5:1 to about 1.5:1. Such compositions can be formed into seals meeting RGD industry standards in a variety of sizes, up to and/or exceeding 5 mm in thickness or cross-sectional diameter.