SILANE-CONTAINING ETHYLENE INTERPOLYMER FORMULATION INCLUDING FILMS AND ELECTRONIC DEVICE MODULE COMPRISING SAME

Disclosed in more detail in this application are ethylene interpolymer films having one or more layers, comprising surface layer comprising: (A) a silane-containing ethylene interpolymer comprising (1) an ethylene interpolymer having a density of less than 0.905 g/cm3, and (2) at least 0.1 percent b...

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Bibliographische Detailangaben
Hauptverfasser:	NAUMOVITZ, John A, NANJUNDIAH, Kumar, PATEL, Rajen M, CERK, Frank J, HUGHES, Morgan M
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	Disclosed in more detail in this application are ethylene interpolymer films having one or more layers, comprising surface layer comprising: (A) a silane-containing ethylene interpolymer comprising (1) an ethylene interpolymer having a density of less than 0.905 g/cm3, and (2) at least 0.1 percent by weight alkoxysilane; characterized by: (3) having a volume resistivity of greater than 5×1015 ohm-cm as measured at 60 C. In one embodiment, such ethylene interpolymer has a residual boron content of less than 10 ppm and residual aluminum content of less than 100 ppm. Also disclosed are laminated electronic device modules comprising: A. at least one electronic device, and B. one of the ethylene interpolymer films as described above in intimate contact with at least one surface of the electronic device. Such laminated electronic device modules according to the invention have been shown to suffer reduced potential induced degradation ("PID").