LED MODULE

The purpose of the present invention is to reduce the size and thickness of an LED module in which a plurality of LED dies along with other electronic components are mounted on a circuit board, and at the same time to stabilize the operation of the module with respect to source voltage fluctuation....

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	WATANABE, Shigehisa, AKIYAMA, Takashi, ARAI, Hidekazu, OCHIAL, Yuki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The purpose of the present invention is to reduce the size and thickness of an LED module in which a plurality of LED dies along with other electronic components are mounted on a circuit board, and at the same time to stabilize the operation of the module with respect to source voltage fluctuation. The LED module includes: a circuit substrate; a plurality of LED dies that are mounted on one surface of the circuit substrate as bare chips and constitute a series circuit; a bypass circuit; a dam enclosing an LED block region and a circuit block region; and a same phosphor containing fluorescent resin for covering the LED block region and the circuit block region.