Active matrix substrate, display device, method for inspecting the active matrix substrate, and method for inspecting the display device

An active matrix substrate (2) is provided with first connecting wirings (64 1 , 64 3 , 64 5 , 64 7 ) connected to gate terminals (51) to which extraction wirings (61 1 , 61 3 , 61 5 , 61 7 ) are connected, second connecting wirings (64 2 , 64 4 , 64 6 ) connected to gate terminals (51) to which ext...

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Bibliographische Detailangaben
Hauptverfasser:	KAWAMURA, TAKEHIKO, YOSHIDA, MASAHIRO, OKADA, KATSUHIRO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADVERTISING ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICESUSING STATIC MEANS TO PRESENT VARIABLE INFORMATION BASIC ELECTRIC ELEMENTS CRYPTOGRAPHY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY DISPLAYING EDUCATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING LABELS OR NAME-PLATES MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEALS SEMICONDUCTOR DEVICES SIGNS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TESTING
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Beschreibung
Zusammenfassung:	An active matrix substrate (2) is provided with first connecting wirings (64 1 , 64 3 , 64 5 , 64 7 ) connected to gate terminals (51) to which extraction wirings (61 1 , 61 3 , 61 5 , 61 7 ) are connected, second connecting wirings (64 2 , 64 4 , 64 6 ) connected to gate terminals (51) to which extraction wirings (61 2 , 61 4 , 61 6 ) are connected, bundled wirings (65 1 to 65 4 ) each composed of a mutually adjacent first connecting wiring and second connecting wiring bundled together, a first inspection wiring (66) capable of inputting an inspection signal to bundled wirings (65 2 , 65 4 ) that are not adjacent to each other among the bundled wirings, and a second inspection wiring (67) capable of inputting an inspection signal to bundled wirings (65 1 , 65 3 ) that are not adjacent to each other and not connected to the first inspection wiring (66) among the bundled wirings.