APPARATUS FOR ADJUSTING RADIATION SPOT SIZE

An apparatus can include a first beam cropper configured to crop a portion of a radiation pulse having a first spot size to form an intermediate cropped radiation pulse having an intermediate cropped spot with an intermediate cropped spot size less than the first spot size; and a second beam cropper...

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Bibliographische Detailangaben
Hauptverfasser:	SUMERFIELD, Leif, O'CONNOR, Ciaran John Patrick, HILLIARD, Shane
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MACHINE TOOLS MEASURING METAL-WORKING NOT OTHERWISE PROVIDED FOR OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TESTING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An apparatus can include a first beam cropper configured to crop a portion of a radiation pulse having a first spot size to form an intermediate cropped radiation pulse having an intermediate cropped spot with an intermediate cropped spot size less than the first spot size; and a second beam cropper configured to crop the intermediate cropped spot to form a second cropped radiation pulse having a second cropped spot with a second cropped spot size less the intermediate cropped spot size.