CURABLE COMPOSITION

The curable composition of the present invention is a curable composition including a liquid polysulfide polymer containing 8% by weight or more of thiol groups in one molecule, an epoxy resin, and an amine, in which the liquid polysulfide polymer is €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒHS-(R-S x ) n -R-SH wherein R is a two valent or three valent organic group containing a -O-CH 2 -O- bond, the average of n is less than 10, - x is an integer of 1 to 5, and the average of x is 1 to 2.5. The curable composition of the present invention has sufficient flexibility, and has a high achievement degree of the hardness at initial hardening relative to the final hardness. The curable composition of the present invention is characterized by fast increase of the hardness during curing, having low viscosity, and having excellent flexibility, water resistance, chemical resistance and weather resistance, and is also good in adhesion, thus is optimally used, particularly for an adhesive for civil engineering and construction, a coating material for civil engineering and construction, a primer for civil engineering and construction, an adhesive for electrical and electronic applications, a potting material for electrical and electronic applications, an adhesive for vehicles, and a primer for vehicles.