METHOD FOR MANUFACTURING SMART CARDS

The method involves applying a protective resin on a side of a dielectric support film (4) for forming a protective layer (11) with thickness corresponding to maximum extension of electronic elements (2). Another protective layer is applied on the former protective layer at the level of an electroni...

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Bibliographische Detailangaben
Hauptverfasser:	DOSSETTO, LUCILE, OTTOBON, STÉPHANE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The method involves applying a protective resin on a side of a dielectric support film (4) for forming a protective layer (11) with thickness corresponding to maximum extension of electronic elements (2). Another protective layer is applied on the former protective layer at the level of an electronic chip (3) with an area along a plane of the support film that is greater than the required format of a smart card (1). The latter protective layer is fixed to the former protective layer by polymerizing the former protective layer, and the obtained assembly is cut to a required format. An independent claim is also included for a smart card.