Heat pipe sink for high power density

Heat pipe sink for high power density

A heat sink (5) is disclosed including a cold plate (30), a plurality of heat pipes (20), and a plurality of fins (10). The cold plate (30) has a first surface arranged substantially vertical and adapted to thermally couple to a heat source. Each of the plurality of heat pipes (20) have an evaporato...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FATSCHEL, STEPHEN, OPILA, DANIEL FRANCIS
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
BLASTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
HEATING
LIGHTING
MECHANICAL ENGINEERING
SEMICONDUCTOR DEVICES
WEAPONS
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Beschreibung
Zusammenfassung:A heat sink (5) is disclosed including a cold plate (30), a plurality of heat pipes (20), and a plurality of fins (10). The cold plate (30) has a first surface arranged substantially vertical and adapted to thermally couple to a heat source. Each of the plurality of heat pipes (20) have an evaporator section arranged substantially vertical and thermally coupled to the cold plate (30), a condenser section arranged at an incline, and a single bend section coupling the evaporator section and the condenser section. The plurality of fins (10) are thermally coupled to the condenser sections of the plurality of heat pipes (20).