DEVICE AND METHOD FOR CUTTING OUT CONTOURS FROM FLAT SUBSTRATES USING A LASER

Generating a contour (1) in a planar substrate (2) and separating the contour from the substrate, comprises (i) generating many individual first zones of internal damage in a contour definition step (a) by means of a laser beam (3) along a contour line, and (ii) removing the substrate material from the substrate and detaching the substrate material from the substrate in material removal- and/or material deformation step (c) after the step (a) by means of laser beam, which is led over the substrate and/or irradiated to the substrate, by material removal and/or plastic deformation. Generating a contour (1) in a planar substrate (2) and separating the contour from the substrate, preferably generating an inner contour in the planar substrate and separating the inner contour from the substrate, comprises (i) generating many individual first zones of internal damage in a contour definition step (a) by means of a laser beam (3), which is guided via the substrate, along a contour line characterizing a contour in the substrate material, and (ii) removing the substrate material from the substrate and detaching the substrate material from the substrate in material removal- and/or material deformation step (c) after the step (a) by means of laser beam, which is led over the substrate and/or irradiated to the substrate, by material removal and/or plastic deformation. An independent claim is also included for a device for carrying out the above mentioned method comprising a beam forming- and beam forming arrangement for generating many individual first zones of internal damage in the step (a) by means of the laser beam along contour line, which characterizes the contour, in the substrate material.