Device and method for cutting out contours from flat substrates using a laser

Generating a contour (1) in a planar substrate (2) and separating the contour from the substrate, comprises (i) generating many individual first zones of internal damage in a contour definition step (a) by means of a laser beam (3) along a contour line, and (ii) removing the substrate material from the substrate and detaching the substrate material from the substrate in material removal- and/or material deformation step (c) after the step (a) by means of laser beam, which is led over the substrate and/or irradiated to the substrate, by material removal and/or plastic deformation. Generating a contour (1) in a planar substrate (2) and separating the contour from the substrate, preferably generating an inner contour in the planar substrate and separating the inner contour from the substrate, comprises (i) generating many individual first zones of internal damage in a contour definition step (a) by means of a laser beam (3), which is guided via the substrate, along a contour line characterizing a contour in the substrate material, and (ii) removing the substrate material from the substrate and detaching the substrate material from the substrate in material removal- and/or material deformation step (c) after the step (a) by means of laser beam, which is led over the substrate and/or irradiated to the substrate, by material removal and/or plastic deformation. An independent claim is also included for a device for carrying out the above mentioned method comprising a beam forming- and beam forming arrangement for generating many individual first zones of internal damage in the step (a) by means of the laser beam along contour line, which characterizes the contour, in the substrate material. Die vorliegende Erfindung betrifft ein Verfahren zum Erzeugen einer Kontur (5) in einem flächigen Substrat (2) und zum Abtrennen der Kontur vom Substrat, insbesondere zum Erzeugen einer Innenkontur in einem flächigen Substrat und zum Heraustrennen der Innenkontur aus dem Substrat, wobei in einem Konturdefinitionsschritt mittels eines über das Substrat geführten Laserstrahls (3) entlang einer die zu erzeugende Kontur (5) kennzeichnenden Konturlinie im Substratmaterial eine Vielzahl einzelner Zonen (5-1,5-2,,...innerer Schädigung erzeugt wird, in einem Rissdefinitionsschritt mittels eines über das Substrat geführten Laserstrahls entlang mehrerer von der Konturlinie aus gesehen unter einem Winkel ± > 0° weg und in die abzutrennende Kontur hinein führenden Risslinienabschnitte (6a