LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

A laser processing apparatus includes a table that places a work thereon, a processing head that emits a laser beam toward the work, a head unit that supports the processing head, a first mover that moves the head unit along the table along a first axis, a second mover that moves the head unit along...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	AMANO, KANEHIDE, KOBAYASHI, EIKI, OHARA, TOSHIHIDE, MATSUDA, MORIKATSU
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A laser processing apparatus includes a table that places a work thereon, a processing head that emits a laser beam toward the work, a head unit that supports the processing head, a first mover that moves the head unit along the table along a first axis, a second mover that moves the head unit along the table along a second axis, a rotor supported in the head unit and turnable around a third axis orthogonal to the first and second axes, and a linear mover supported inside the rotor and linearly movable in both directions along a diameter of the rotor for a predetermined movable distance shorter than the diameter of the rotor, the linear mover supporting the processing head so that the laser beam from the processing head advances along a fourth axis parallel to the third axis.