Module substrate and duplexer module

A module substrate (100) includes: a multilayered wiring substrate (30) that includes wiring layers; and embedded duplexers (40; 40a,40b,40c,40d) that are embedded in the multilayered wiring substrate and electrically connected to the wiring layers, wherein the embedded duplexers include duplexers s...

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Bibliographische Detailangaben
Hauptverfasser: Tasaka, Naoyuki, Sasaki, Ken, Takezaki, Tooru
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:A module substrate (100) includes: a multilayered wiring substrate (30) that includes wiring layers; and embedded duplexers (40; 40a,40b,40c,40d) that are embedded in the multilayered wiring substrate and electrically connected to the wiring layers, wherein the embedded duplexers include duplexers supporting at least two bands of Band1, Band2, Band5, and Band8. Duplexers (60) supporting regional bands may be mounted on the multilayered wiring substrate.