SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Provide is a semiconductor device configured such that a control terminal (13) is soldered onto a patterned insulating substrate (42) which is fixedly attached to a heat dissipating base (41). A resin case (1) is bonded to the rim of the heat dissipating base (41) to cover the patterned insulating substrate (42) of the heat dissipating base (41). The control terminal (13) is exposed to the outside of the resin case (1) from an opening (2) of the resin case (1). First and second projections (16, 17) provided on a side end surface (14) of the control terminal (13) are fitted to a convex step portion (26) of a resin block (21) inserted into the opening (2) of the resin case (1). According to the above configuration, even when external force such as a compressive load or tensile load is applied to the control terminal (13), the control terminal (13) can be prevented from sinking into the resin case (1) or being pulled out of the resin case (1).