COMPOSITION FOR CLEANING SUBSTRATES POST-CHEMICAL MECHANICAL POLISHING

A semiconductor processing composition and method for cleaning semiconductor wafers post chemical mechanical polishing comprising a phosphorous base and optionally at least one surfactant.

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Bibliographische Detailangaben
Hauptverfasser:	OTAKE, ATSUSHI, SHANG, CASS, X, BERNATIS, PAUL, R
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES CANDLES CHEMISTRY DETERGENT COMPOSITIONS DETERGENTS FATTY ACIDS THEREFROM METALLURGY RECOVERY OF GLYCEROL RESIN SOAPS SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
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Beschreibung
Zusammenfassung:	A semiconductor processing composition and method for cleaning semiconductor wafers post chemical mechanical polishing comprising a phosphorous base and optionally at least one surfactant.