A MN DOPED SN-BASE SOLDER ALLOY AND SOLDER JOINTS THEREOF WITH SUPERIOR DROP SHOCK RELIABILITY

A Sn-Ag-Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder comprises between greater than 0 wt.% and less than or equal to about 1.5 wt.% Ag; between greater than or equal to about 0.7 wt.% and less than or equal to about 2.0 wt.%...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LIU, WEIPING, LEE, NINGNG
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS POWDER METALLURGY PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM WORKING METALLIC POWDER
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A Sn-Ag-Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder comprises between greater than 0 wt.% and less than or equal to about 1.5 wt.% Ag; between greater than or equal to about 0.7 wt.% and less than or equal to about 2.0 wt.% Cu; between greater than or equal to about 0.001 and less than or equal to about 0.2 wt.% Mn; and a remainder of Sn.