Semiconductor module

An object of the present invention is to provide a semiconductor module in which the plastic housing is easily fitted to the auxiliary terminals in the assembly process, and in the process of attaching a connector for external terminals, any external force on the auxiliary terminals is prevented fro...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HORIE, SHUNTA
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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