Semiconductor module

An object of the present invention is to provide a semiconductor module in which the plastic housing is easily fitted to the auxiliary terminals in the assembly process, and in the process of attaching a connector for external terminals, any external force on the auxiliary terminals is prevented from being transmitted to the bottom part of the auxiliary terminals and to the insulated circuit board. In order to achieve the above object, a semiconductor module of the invention comprises semiconductor elements 22 mounted on an insulated circuit board 21 adhered on the metallic base plate 20, a plastic housing 26 for accommodating the semiconductor elements 22, and metallic main terminals 24 led out from openings 28a and metallic auxiliary terminals 25 led out from opening 28b on flat surfaces of the plastic housing 26. The openings 28b for leading out the auxiliary terminals 25 are formed on a peripheral lower part 33 of the upper surface of the plastic housing 26, and a holding piece 340 (or 341, 342, 343) for fastening the auxiliary terminals 25 is provided between a central higher flat surface 32 and the auxiliary terminals 25.