SOLDER COMPOSITIONS

A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.

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Bibliographische Detailangaben
Hauptverfasser: LODGE, Dominic, SINGH, Bawa, SARKAR, Siuli, RAUT, Rahul, DE AVILA RIBAS, Morgana, CHATTOPADHYAY, Kamanio, NANDI, Proloy, BHATKAL, Ravindra M, PANDHER, Ranjit
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.