Substrate recycling method

Exemplary embodiments of the present invention provide a substrate recycling method and a recycled substrate. The method includes separating a substrate having a first surface from an epitaxial layer, performing a first etching of the first surface using electrochemical etching, and performing, afte...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Kim, Chang Yeon, Heo, Jeong Hoon, Choi, Joo Won, Kim, Young Wug, Ryu, Sang Wan, Hong, Su Yeon
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:Exemplary embodiments of the present invention provide a substrate recycling method and a recycled substrate. The method includes separating a substrate having a first surface from an epitaxial layer, performing a first etching of the first surface using electrochemical etching, and performing, after the first etching, a second etching of the first surface using chemical etching, dry etching, or performing, after the first etching, chemical mechanical polishing of the first surface.