Low profile surface mount package with isolated tab

A surface mount package (10,70,80) includes at least one semiconductor device (12) and a POL packaging and interconnect system (20) formed about the at least one semiconductor device (12) that is configured enable mounting of the surface mount package to an external circuit. The POL system (20) includes a dielectric layer (24,82) overlying a first surface of the semiconductor device(s) and a metal interconnect structure extending through vias (28) formed through the dielectric layer (24,82) so as to be electrically coupled to connection pads (30) on the semiconductor device(s). A metallization layer (34) is formed over the metal interconnect structure that comprises a flat planar structure, and a double-sided ceramic substrate (54) is positioned on a second surface of the semiconductor device(s) (12), with the double-sided ceramic substrate (54) being configured to electrically isolate a drain (64) of the semiconductor device(s) from an external circuit (50) when the surface mount package (10,70,80) is joined thereto and to conduct heat away from the semiconductor device(s) (12).