METHOD AND APPARATUS FOR SELF-ANNEALING MULTI-DIE INTERCONNECT REDUNDANCY CONTROL

METHOD AND APPARATUS FOR SELF-ANNEALING MULTI-DIE INTERCONNECT REDUNDANCY CONTROL

An apparatus for interconnecting a first die and a second die of a multi-die device includes a master circuit block that interfaces with the first die of the multi-die device, a slave circuit block that interfaces with the second die of the multi-die device, a first memory in the slave circuit block...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: CAMAROTA, Rafael, C
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PULSE TECHNIQUE
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:An apparatus for interconnecting a first die and a second die of a multi-die device includes a master circuit block that interfaces with the first die of the multi-die device, a slave circuit block that interfaces with the second die of the multi-die device, a first memory in the slave circuit block, a second memory in the master circuit block, and a plurality of mubumps between the first die and the second die, wherein the master circuit block and the slave circuit block are configured to identify one of the mubumps as a faulty mubump, and store a first value that corresponds with the identified faulty mubump in the first memory.