SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

A semiconductor device is constituted by a metal base (6), a wiring substrate (2) joined to the metal base (6), a semiconductor chip (1) and a control terminal (5) joined to circuit patterns (2a, 2b) of the wiring substrate (2), and a resin case (20) bonded to the metal base (6). The control terminal (5) is constituted by a through section (5a) passing through a lid (21) of the resin case (20), a linking section (5b) linked to the through section (5a), and a connection section (5c) linked to the linking section (5b). A blocking section (5d) and a cut-out section (5e) are provided in the portion of the control terminal (5) that passes through the lid (21). The blocking section (5d) is in contact with a step (21b) formed on the front surface of the lid (21). When the through section (5a) passes through the lid (21) of the resin case (20), the blocking section (5d) is accommodated inside the cut-out section (5e). The linking section (5b) is in contact with a protrusion (21c) provided on the rear surface of the lid (21).