Contact spring for a test socket for the high power testing of an electronic component

The contact spring (3) has opposing lateral faces, spring arm and a testing arm with a testing tip. The testing arm forms an angle with the spring arm. The distance between the points on the lateral faces is set less than or equal to 2.3 times the spring length. The distance from the testing tip to the point located on a boundary line of the lateral face is set to 4 times the spring length. The spring length is made to correspond to the minimum thickness of spring arm in the relative movement direction of a testing base (1) and the electronic component.