Apparatus equipped with heat sink

An apparatus is provided, the apparatus comprising: a casing (100); a heat sink (150) configured to radiate heat emitted from the casing (100); and a fixing plate (200) configured to fix the heat sink (150) by holding the heat sink (150) between the fixing plate (200) and the casing (100).

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Bibliographische Detailangaben
Hauptverfasser:	TAKASHIRO, HIROTO, AKAMOTO, KEIGO, OHASHI, SHINSUKE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	An apparatus is provided, the apparatus comprising: a casing (100); a heat sink (150) configured to radiate heat emitted from the casing (100); and a fixing plate (200) configured to fix the heat sink (150) by holding the heat sink (150) between the fixing plate (200) and the casing (100).