Releasable substrate on a carrier

A method and system are disclosed for providing a releasable substrate 13a on a carrier 11. The method comprises providing the carrier 11 with a bonding layer 12 of radiation curable adhesive 12m; selectively irradiating a first area subsection 12a of the bonding layer 12 with a first radiation 14a for selectively at least partially curing the first area subsection 12a; providing a substrate 13 and bringing the substrate 13 in contact with the first area subsection 12a and a second area subsection 12b of the bonding layer 12; curing the second area subsection 12b in contact with the substrate 13 for forming an adhesion area 15b between the second area subsection 12b and the substrate 13. The first area subsection 12a forms a release area 15a an adhesion force between the bonding layer 12 and the substrate 13 being lower in the release area 15a than in the adhesion area 15b as a result of the first area subsection 12a being more cured than the second area subsection 12b prior to being in contact with the substrate 13.