Polyamide moulding compositions and their use in the production of moulded articles

Polyamide (PA) molding compound comprises (a) 20-99 wt.% of at least one PA, (b) 0.05-5 wt.% of nigrosin, (c) 0.005-2 wt.% of at least one nucleation agent, and (d) 0-79.945 wt .% of at least one additive or supplement, where the carbon black is not a component of the PA molding compound. Independen...

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Bibliographische Detailangaben
Hauptverfasser:	Roth, Mark D, Lamberts, Nikolai, Hoffmann, Botho
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Polyamide (PA) molding compound comprises (a) 20-99 wt.% of at least one PA, (b) 0.05-5 wt.% of nigrosin, (c) 0.005-2 wt.% of at least one nucleation agent, and (d) 0-79.945 wt .% of at least one additive or supplement, where the carbon black is not a component of the PA molding compound. Independent claims are included for: (1) producing molded articles made of the PA molding compound, which is extruded or injection-molded; and (2) producing components with increased temperature requirements up to 230[deg] C comprising utilizing the PA molding compound in the production of the components.