Systems and methods for isolating MEMS against high frequencies

Systems and methods for providing vibration isolation for a MEMS device are provided. In at least one embodiment, a system comprises a first assembly and a second assembly, wherein the second assembly and the first assembly are joined together, enclosing the MEMS device, wherein the joined first assembly and the second assembly have a recessed groove formed on an interior surface. Further, the system comprises a rigid support encircling the MEMS device, the rigid support fitting within the recessed groove; and at least one mount isolator in contact with a plurality of surfaces of the rigid support, wherein the at least one mount isolator interfaces the plurality of surfaces of the rigid support with the first assembly and the second assembly, when the first assembly and the second assembly are joined together.