ARRANGEMENT FOR THE TEMPERATURE CONTROL, IN PARTICULAR COOLING, OF HEAT-GENERATING COMPONENTS USING A COOLING PLATE

The invention relates to an arrangement for the temperature control, in particular cooling, of heat-generating components using a cooling plate which is thermally connected to the heat-generating components, wherein the cooling plate has cooling ducts through which a cooling medium can flow, in part...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TRITSCHLER, Daniel, SCHÜTTERLE, Ingo, KOKER, Torsten
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention relates to an arrangement for the temperature control, in particular cooling, of heat-generating components using a cooling plate which is thermally connected to the heat-generating components, wherein the cooling plate has cooling ducts through which a cooling medium can flow, in particular wherein the resistance to the transfer of heat from the heat-generating components via the cooling plate to the cooling medium flowing through the cooling ducts is lower than on any other heat-conducting path from the heat-generating components to the cooling medium flowing through the cooling ducts, wherein the cooling medium is led through a first cooling duct in a first direction and then through a second cooling duct in the opposite direction and then in a third cooling duct in the first direction.