AQUEOUS ACIDIC BATH FOR ELECTROLYTIC DEPOSITION OF COPPER

AQUEOUS ACIDIC BATH FOR ELECTROLYTIC DEPOSITION OF COPPER

The invention relates to an aqueous acidic bath for electrolytic deposition of copper, comprising, at least one source of copper ions, at least one acid, at least one brightener compound, and at least one leveler and/or promoter for copper-deposition, wherein at least one leveler and/or promoter is...

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Bibliographische Detailangaben
Hauptverfasser: DAMBROWSKY, NINA, EWERT, INGO, DAMBROWSKY, CHRISTOF, WENZEL, RENÉ, HAUF, UWE
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:The invention relates to an aqueous acidic bath for electrolytic deposition of copper, comprising, at least one source of copper ions, at least one acid, at least one brightener compound, and at least one leveler and/or promoter for copper-deposition, wherein at least one leveler and/or promoter is a ruthenium compound, and to a process for the electrolytic deposition of copper, in particular for filling blind micro vias, through hole vias, trenches and similar structures on printed circuit boards, chip carriers and semiconductor wafers.