INDUCED THERMAL GRADIENTS

An apparatus comprising: a semiconductor die including: a first thermal sensor and a second thermal sensor, the first and second thermal sensors to detect a thermal gradient, and logic circuitry to provide a thermal offset bit to a storage location for the thermal offset bit of a mode register of a...

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1. Verfasser: SHOEMAKER, KENNETH D
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description An apparatus comprising: a semiconductor die including: a first thermal sensor and a second thermal sensor, the first and second thermal sensors to detect a thermal gradient, and logic circuitry to provide a thermal offset bit to a storage location for the thermal offset bit of a mode register of a memory die responsive to detection of a change in the thermal gradient, the memory die including dynamic random access memory (DRAM); wherein the thermal offset bit is to direct a temperature compensated self-refresh (TCSR) logic of the memory die to modify a self-refresh rate of the DRAM; wherein the first thermal sensor is to be aligned with or in close proximity with a memory thermal sensor of the memory die, and wherein the second thermal sensor of the semiconductor die is located at a hot spot of the semiconductor die.
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subjects BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
title INDUCED THERMAL GRADIENTS
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