SEMICONDUCTOR MODULE

A semiconductor module (100) is manufactured by bonding a resin case (8) having a first opening (11) through which surfaces of main circuit terminals (4) and control terminals (5) are exposed, onto a metal heat-dissipating substrate (1) onto which is bonded, a conductive-patterned insulating substrate (2) onto which are bonded, semiconductor chips, the main circuit terminals (4), and the control terminals (5); inserting into and attaching to a second opening (11) formed on a side wall constituting the resin case (8), a resin body (7) having a nut (22) embedded therein to fix each of the main circuit terminals (4) and the control terminals (5); and filling the resin case (8) with a resin material (9). In the semiconductor module (100), a side wall (18) of the first opening (11) is tapered to become narrowed toward the surface thereof; a tapered contact portion (19) to be in contact with the tapered side wall is disposed on the control terminal (5); and the resin body (7) having the nut (22) embedded therein fixes the control terminal (5) having a one-footing structure that is an independent terminal. Thereby, surface heights (17) of the control terminals (5) can equalized with high precision.