Power semiconductor module with at least one stress-reducing adjustment element

Power semiconductor module with at least one stress-reducing adjustment element

The module has a substrate (2) arranged on a cooling device or a base plate. A power semiconductor component (30) is electrical conductively connected with strip conductors (220, 222). An adjustment element (50) and a connector (60) are arranged on the strip conductors. A major surface of the adjust...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Beckedahl, Peter, Augustin, Karlheinz, Faltenbacher, Josef, Sagebaum, Ulrich, Windischmann, Jürgen
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The module has a substrate (2) arranged on a cooling device or a base plate. A power semiconductor component (30) is electrical conductively connected with strip conductors (220, 222). An adjustment element (50) and a connector (60) are arranged on the strip conductors. A major surface of the adjustment element is fixed adjacent to the connector such that two connection types are formed while another major surface of the adjustment element is electrical conductively and firmly bonded by a connection unit (70), where the latter major surface is fixed adjacent to one of strip conductors. The connector is designed as load and auxiliary connectors.