MULTIPLE STEP PRETREATMENT OF TIN PLATED STEEL BEFORE LACQUERING

The invention relates to a two-stage method for the anti-corrosive pretreatment of tinplate, in which an anti-corrosive primer coating is applied in a first step, in which the tinplate is anodically polarized in an electrolyte containing at least one inert water-soluble salt and is then in a second...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	STODT, JÜRGEN, SUNDERMEIER, UTA, ROTH, MARCEL, WOLPERS, MICHAEL
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES HANDLING THIN OR FILAMENTARY MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS STORING SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention relates to a two-stage method for the anti-corrosive pretreatment of tinplate, in which an anti-corrosive primer coating is applied in a first step, in which the tinplate is anodically polarized in an electrolyte containing at least one inert water-soluble salt and is then in a second step, brought in contact with an acidic aqueous composition containing water-soluble inorganic compounds of the elements Zr, Ti, Hf, and/or Si.