Method for making an aluminium coated copper bond wire

The invention relates to a wire, preferably a bonding wire for bonding in microelectronics, comprising a copper core (2) with a surface and coating layer (3), which coating layer (3) is superimposed over the surface of the core (2), wherein the coating layer comprises aluminium (3), wherein in any c...

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Bibliographische Detailangaben
Hauptverfasser:	Prenosil, Peter, Thomas, Sven, Dr, Milke, Eugen, Dr
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CABLES CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CONDUCTORS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention relates to a wire, preferably a bonding wire for bonding in microelectronics, comprising a copper core (2) with a surface and coating layer (3), which coating layer (3) is superimposed over the surface of the core (2), wherein the coating layer comprises aluminium (3), wherein in any cross-sectional view of the wire the area share of the coating layer is in the range of from 20 to 50 %, based on the total area of the cross-section of the wire, and wherein the aspect ratio between the longest path and the shortest path through the wire in any cross-sectional view is in the range of from larger than 0.8 to 1.0, and wherein the wire has a diameter in the range of from 100 µm to 600 µm. The invention further relates to a process for making a wire, to a wire obtainable by said process, to an electric device comprising at least two elements and at least aforementioned wire, to a propelled device comprising said electric device and to a process of connecting two elements through aforementioned wire by wedge bonding.