CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME

CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME

Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: OHMORI, Kazuyuki, SUNAMOTO, Tatsuya
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.