SEMICONDUCTOR MODULE, MOULD DEVICE, AND MOULD-FORMING METHOD

SEMICONDUCTOR MODULE, MOULD DEVICE, AND MOULD-FORMING METHOD

A semiconductor module includes a plurality of semiconductor elements, a first tabular electrode coupled to one face side of the plurality of semiconductor elements, a second tabular electrode coupled to the other face side of the plurality of semiconductor elements, and a molding material that enca...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KOBAYASHI, SHUUJI, KOMIYAMA, FUMIYUKI, ADACHI, SHUUJI
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:A semiconductor module includes a plurality of semiconductor elements, a first tabular electrode coupled to one face side of the plurality of semiconductor elements, a second tabular electrode coupled to the other face side of the plurality of semiconductor elements, and a molding material that encapsulates the plurality of semiconductor elements between the first electrode and the second electrode. A protrusion extending toward the second electrode is provided in a circumferential edge portion of the first electrode, and the protrusion surrounds the molding material.